A fixing apparatus includes a heating member, a supporting member that supports the heating member, a film slidably disposed on the heating member, and a pressing member that forms a nip portion, in collaboration with the film, through which the recording medium is conveyed. The fixing apparatus further includes a first thermally conductive member and a second thermally conductive member that are disposed between the heating member and the supporting member. The first thermally conductive member has a thermal conductivity higher than that of a substrate of the heating member. The thermal conductivity in in-plane directions of the second thermally conductive member is higher than the thermal conductivity in a thickness direction thereof. The second thermally conductive member is in contact with the heating member, and the first thermally conductive member is in contact with the second thermally conductive member.
