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Conductive Grid Sensor for Smart Packaging
专利权人:
Vatex Explorations; LLC
发明人:
James Wayne Harris
申请号:
US14620792
公开号:
US20150228178A1
申请日:
2015.02.12
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A blister packaging including a blister card including a plurality of flexible blisters; and a backing sheet including blister backing portions and backing securing portions, wherein when the backing securing portions are secured to the blister card, the blister backing portions are aligned to each blister forming a plurality of compartments adapted to store a medicament, and wherein the backing includes two or more conductive first leads affixed to the backing, two or more conductive second leads affixed to the backing, and a plurality of conductive zones, wherein each conductive zone electrically connects one of the first leads to one of the second leads, and wherein each blister backing portion includes a conductive zone.
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