Systems And Methods For Assessing The Quality Of Adhesive Bonds

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专利权人:

Board of Regents, The University of Texas System

发明人:

Reifsnider Kenneth L.,Raihan Md Rassel,Elenchezhian Muthu Ram Prabhu,Banerjee Priyanshu Kumar,Dave Chaitanya,Vadlamudi Vamsee

申请号：

US201815989541

公开号：

US2018340900(A1)

申请日:

2018.05.25

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/