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DISPERSION DE CUIVRE MÉTALLIQUE, SON PROCÉDÉ DE FABRICATION ET UTILISATION ASSOCIÉE
专利权人:
Ltd.;Ishihara Sangyo Kaisha
发明人:
申请号:
EP14830349.8
公开号:
EP3025811B1
申请日:
2014.07.24
申请国别(地区):
EP
年份:
2020
代理人:
摘要:
The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g. The metallic copper dispersion is manufactured by reducing copper oxide in an aqueous solvent in the presence of gelatin, then performing solid-liquid separation, and then mixing the obtained metallic copper particles having gelatin on the particle surface and the polymer dispersant into the organic solvent.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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