The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature process. A photosensitive resin composition is obtained which is characterized by comprising (A) a polymeric precursor having repeating units of a polyamic acid or a polyamic acid ester in at least a portion thereof, and (B) a nonionic photoreactive latent basic substance which generates strongly basic tertiary amine upon irradiation of active light.
