Jason Harris Karp,Christopher James Kapusta,Paul Jeffrey Gillespie,Christopher Fred Keimel,Jeffrey Michael Ashe,James Enrico Sabatini
申请号：
US15092655
公开号：
US09814419B2
申请日:
2016.04.07
申请国别(地区):
US
年份:
2017
代理人:
摘要：
An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
