セラミック体とＮｉ−Ｃｒ−Ｆｅ合金との接合体、およびセラミック体とＮｉ−Ｃｒ−Ｆｅ合金との接合方法

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专利权人:

京セラ株式会社

发明人:

田中 淳

申请号：

JP20130163749

公开号：

JP6266918(B2)

申请日:

2013.08.07

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a metalized substrate having comparatively small degradation to joining strength before heat treatment at relatively high temperature even after the heat-treatment, and a joint body of aluminum with ceramics.SOLUTION: In the metalized substrate, a metal film including at least Ag, Ti and Al is formed on the principal surface of a ceramic substrate, and a connecting layer including 10 mass% or more of each AL and O and 50 mass% or more of the total amount of Al and O is formed in a boundary portion between the metal film and the ceramic substrate.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/