A kit for providing a polymerizable resin system is disclosed, which kit comprises a first Part A and a second Part B, which Part A and Part B upon mixing provides a working period of intermediate stage polymerization in which the mixture obtains a desired cohesiveness for a predetermined period of time. The first Part A comprises an acid and the second Part B comprises an organic compound that is water soluble or partially water soluble and that, in the presence of the acid, initiates curing of polymerizable monomer and/or resin that is present in Part A, Part B, or both. Also disclosed is a method of using the mixed composition as an adhesive, cement, glue, sealant, a base liner, a capping agent, a material for surface or structural repair and/or filling, an encasing material, a bodily implant, a dental material, and/or as a polymeric object having a living polymer surface property.
