Systems and methods for fabricating and using ultrasound gel module assemblies in accordance with embodiments of the invention are illustrated. One embodiment includes an ultrasound gel module assembly including a gel pad attached to a base component, where the gel pad is capable of conducting ultrasound, and a cover component covering a first side of the gel pad and in contact with the base component. In another embodiment, a method for using an ultrasound gel module assembly includes removing a cover component from a gel module assembly, where the cover component covers a first side of a gel pad attached to a base component, and the base component includes a set of attachment points configured to enable the base component to be connected to a holder, attaching the base component to the holder, and transmitting ultrasound through the gel pad from an ultrasound transducer connected to the holder.
