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Method for reviewing defects
专利权人:
UNITED MICROELECTRONICS CORP.
发明人:
Tsai Yung-Teng,Lin Hung-Chin,Sun Chia-Chen,Wu Chih-Yu,Chen Jun-Ming,Hung Chung-Chih,Chen Sheng-Chieh
申请号:
US201816108054
公开号:
US10156526(B1)
申请日:
2018.08.21
申请国别(地区):
美国
年份:
2018
代理人:
Hsu Winston
摘要:
A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.
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