DIE

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专利权人:

UNITED MICROELECTRONICS CORP.

发明人:

Tsai Yung-Teng,Lin Hung-Chin,Sun Chia-Chen,Wu Chih-Yu,Chen Jun-Ming,Hung Chung-Chih,Chen Sheng-Chieh

申请号：

US201816108071

公开号：

US2018356348(A1)

申请日:

2018.08.21

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/