A receptacle is provided for connecting an electronics enclosure to an absorbent article having at least one sensor element. The receptacle includes: a base frame having a base surface an enclosure retainer for retaining the enclosure relative to the base surface at an engagement position and at least one contact support surface, oriented toward the engagement position, arranged to be displaceable away from the engagement position relative to the base surface and biased to protrude from the base surface toward the engagement position. An absorbent article and method of manufacture thereof and an absorbent article management system using the receptacle are also provided.