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SPINAL IMPLANT PACKAGING
专利权人:
Inc.;Warsaw Orthopedic
发明人:
LEIGH ANNA FOLGER,David Mire,Caleb D. Smith,Christine Carmer
申请号:
US16225935
公开号:
US20200197120A1
申请日:
2018.12.19
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A spinal implant package includes a sleeve defining a cavity extending through an end surface of the sleeve. A cap defines an aperture extending through an end surface of the cap. First portions of the end surfaces are joined to define a hinge. The end surface of the sleeve includes a second portion defining a first lip. The end surface of the cap includes a second portion defining a second lip. The package is movable between a closed configuration in which the first lip is adjacent the second lip and a portion of the spinal implant is enclosed within the cavity and the aperture, and an open configuration in which the first lip is spaced farther apart from the second lip and the portion of the spinal implant is positioned outside of the aperture while remaining positioned inside of the cavity.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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