Moisture curable adhesive compositions their preparation and use are disclosed herein. The moisture curable adhesive compositions include one or more reactive polymers such as reactive silicone polymers one or more adhesive components such as a silicone pressure sensitive polymer(s) (PSAs) a cross linker and a catalyst. Typically the reactive silicone polymer or polymers are hydroxyl terminated polydimethylsiloxanes (PDMS) having at least two hydroxyl functionalities associated with the polymer(s).
