A micro component transfer method and apparatus, and an electronic device. The transfer method comprises steps of: placing at least one micro component (200) on a first substrate (100); enabling a transfer head (300) made of a biomimetic gecko material to face and contact with the micro component, and absorbing the micro component by means of the adhesive capability of the biomimetic gecko material, so as to extract a required micro component; and enabling the transfer head to face a second substrate (400), and desorbing the micro component by means of the desorption capability of the biomimetic gecko material, so as to release the required micro component on the second substrate.
