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In-Package IMD Configuration Management, Self-Test, and Programming Support System for Acoustic Communication Enabled Implants
专利权人:
BIOTRONIK SE &; Co. KG
发明人:
Kurt Swenson,Brian M. Taff
申请号:
US16811189
公开号:
US20200316390A1
申请日:
2020.03.06
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The present disclosure relates to a system, comprising: an implantable medical device, wherein the implantable medical device comprises an ultrasound transducer configured to receive an ultrasound wave, a packaging, wherein the packaging encloses an internal space, wherein the implantable medical device is arranged in the internal space, and a device mount arranged in the internal space, wherein the implantable medical device is fastened to the device mount in a releasable fashion, and wherein the device mount contacts an inner side of a portion of the packaging and forms an acoustic coupler configured to pass an ultrasound wave applied to an outer side of the portion of the packaging to the ultrasound transducer of the implantable medical device.
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中国工程科技知识中心
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http://www.ckcest.cn/home/
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