Scott Green,Yogesh B. Gianchandani,Richard Kwon,Grace Elta,Jiqing Jiang,Ramprasad Nambisan
申请号：
US16841323
公开号：
US20200319268A1
申请日:
2020.04.06
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.
