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Compositions and methods for the treatment of inflammation and pain
专利权人:
Mahesh Kandula
发明人:
Mahesh Kandula
申请号:
US14805507
公开号:
US10343994B2
申请日:
2015.07.22
申请国别(地区):
US
年份:
2019
代理人:
摘要:
The invention relates to the compounds of formula I, formula II, formula III, formula IV and formula V or its pharmaceutical acceptable polymorphs, solvates, enantiomers, stereoisomers and hydrates thereof. The pharmaceutical compositions comprising an effective amount of compounds of formula I, formula II, formula III, formula IV or formula V and methods for the treatment of inflammation and pain may be formulated for oral, buccal, rectal, topical, transdermal, transmucosal, intravenous, oral solution, buccal mucosal layer tablet, parenteral administration, syrup, or injection. Such compositions may be used to treatment of pain, oral mucosal inflammatory or oral infectious diseases.
来源网站:
中国工程科技知识中心
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