Disclosed are a backing block (100) of an ultrasonic area-array probe, an ultrasonic area-array probe comprising the backing block (100), and an ultrasonic diagnosis and imaging device comprising the ultrasonic area-array probe. A connecting circuit (120) of the backing block (100) has multiple leads (121), wherein each of the leads (121) has a first connecting end (1211) located at an end face (1111) of a first end portion (111) of a backing block body (110), and has a second connecting end (1212) passing through the interior of the backing block body (110) and extending to an end face (1121) of a second end portion (112). In order to reduce the alignment difficulty in connecting the second connecting ends (1212) to an adapter circuit, for at least some adjacent leads (121) of the connecting circuit (120), the spacing between the second connecting ends (1212) is designed to be greater than the spacing between the first connecting ends (1211), such that the connecting circuit (120) can be distributed more widely on the end face (1121) of the second end portion (112) of the backing block body (110), and the distance between the adjacent second connecting ends (1212) is greater, thereby facilitating the alignment connection between the second connecting ends (1212) and the corresponding positions on the adapter circuit and reducing the manufacturing difficulty thereof.L'invention concerne un bloc de support (100) d'une sonde ultrasonore à matrice bidimensionnelle, une sonde ultrasonore à matrice bidimensionnelle comprenant le bloc de support (100) et un dispositif de diagnostic et d'imagerie à ultrasons comprenant la sonde ultrasonore à matrice bidimensionnelle. Un circuit de connexion (120) du bloc de support (100) comporte de multiples conducteurs (121), chacun des conducteurs (121) comportant une première extrémité de connexion (1211) située au niveau d'une face d'extrémité (1111) d'une première partie d'extrémité (111) d'un corps de bloc de support (110), et une s
