An ear pad for use with a headphone apparatus. The ear pad comprises a pad portion comprising an outer circumference and an inner circumference defining an opening. The pad portion comprises an upper width between the outer and inner circumferences along a vertical mid-line of the pad portion, a lower width between the outer and inner circumferences along the vertical mid-line of the pad portion, a left side width between the outer and inner circumferences along a horizontal mid-line of the pad portion, and a right side width between the outer and inner circumferences along the horizontal mid-line of the pad portion. The lower width of the pad portion is greater than at least one of the left and right side widths of the pad portion.
