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SLOPE SEEDING AND PLANTING CONSTRUCTION METHOD
专利权人:
NIPPON KENSETSU GIJUTSU KK;KENSETSU KANKYO ENGINEERING KK
发明人:
HARA YUTAKA
申请号:
JP20040085263
公开号:
JP2005273209(A)
申请日:
2004.03.23
申请国别(地区):
日本
年份:
2005
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a slope seeding and planting construction method capable of forming a slope suitable for growing plants, and capable of effectively utilizing waste wood and unnecessary sediment. SOLUTION: A fluid base material 10 is manufactured by kneading a mixture for a predetermined time by inputting a chip material, a granular body of foaming glass, sediment gathered from the surface of the ground 3a of a construction site, a vegetation base material, a nodulizing agent, a pressure sensitive adhesive, compost, seeds of plants and water in a kneader. After stretching a lath wire net 11 along the surface of the ground 3a completed in ground leveling work, the base material 10 is sprayed so as to cover the surface of the ground 3a and the upper surface of the lath wire net 11 by using a sprayer 12. After spraying, when the base material is stationarily placed as it is for 3.0 hours to 8.0 hours, the base material 10 is hardened by the action of the nodulizing agent and the pressure sensitive adhesive, and a seeding and planting layer 13 is formed. COPYRIGHT: (C)2006,JPO&NCIPI
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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