A novel electrode array is described for ear implant systems such as cochlear implants (CI) and vestibular implants (VI). The electrode array includes electrode wires for carrying electrical stimulation signals. At a terminal end of each electrode wire is an electrode stimulation contact for applying the electrical stimulation signals to adjacent neural tissue. An electrode carrier of resilient material encases the electrode wires and has an outer surface with a plurality of contact openings exposing the stimulation contacts. A bend control element is helically wound along a portion of the electrode array to control bending flexibility of the electrode array as a function of a bend radius threshold.
