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MULTI-MODAL SENSOR FUSION PLATFORM
专利权人:
INTERLINK ELECTRONICS; INC.
发明人:
Chee Wai LU,Wai Jye CHAN,Kok Keong LAW,Cheng Seong LEE
申请号:
US16474873
公开号:
US20190335843A1
申请日:
2018.01.03
申请国别(地区):
US
年份:
2019
代理人:
摘要:
A system may include a bottom layer and a sensing layer disposed on a first side of the bottom layer. The first sensing layer may include a first sensing element and a second sensing element. The first sensing element and the second sensing element may include one of: a force sensing element, a strain sensing element, a motion sensing element, or an environmental sensing element. The first sensing element and the second sensing element may be of a different type of sensing element. The system may also include a communications interface configured to couple the sensing layer with a host controller.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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