PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic unit which enables improvement of the airtightness of an external resin disposed at the external side of resins doubly covering an electronic component.SOLUTION: In a manufacturing method of an electronic unit, the electronic unit is manufactured by using a housing body 49 having a bottom plate 55 and a side wall 56 erected from an outer edge of the bottom plate and an electronic component covering body 61 formed by an electronic component 46 covered by a high-temperature resin 47. The manufacturing method includes: an injection step where the housing body is disposed so that the bottom plate is located at the lower side and a resin fluent material 48c is injected into the housing body an electronic component arrangement step where the electronic component covering body is immersed in the resin fluent material and arranged so as to form a gap T1 between itself and the housing body to cause at least a part of an outer surface of the high-temperature resin to be covered with the resin fluent material after the injection step and a resin solidification step where the resin fluent material is solidified to form an exterior resin.SELECTED DRAWING: Figure 8COPYRIGHT: (C)2016,JPO&INPIT【課題】電子部品を二重に覆う樹脂のうち外側に配置される外部樹脂の気密性を高めることができる電子ユニットの製造方法を提供する。【解決手段】底板55および底板の外縁から立設する側壁56を有する収容体49と、耐熱樹脂47で覆われた電子部品46からなる電子部品被覆体61と、を用いて電子ユニットを製造する電子ユニットの製造方法であって、収容体を底板が下方となるように配置し、樹脂流動体48cを収容体内に流し込む注入工程と、注入工程の後で、樹脂流動体に電子部品被覆体を漬けるとともに、収容体と電子部品被覆体との間に隙間T1が形成されるように配置することで、耐熱樹脂の外面の少なくとも一部を樹脂流動体で覆う電子部品配置工程と、樹脂流動体を固化させて外部樹脂とする樹脂固化工程と、を備える。【選択図】図8
