A package is composed of a resin molded body packaging a manipulator of a manipulator system including a base member having a target portion on an upper surface, and the manipulator having a connecting portion detachably connected to the target portion. The package includes a cover portion having a size capable of covering at least a portion of the upper surface of the base member, and a forming portion having easy-cut lines provided in a portion of the cover portion. The forming portion is configured such that by cutting the forming portion along the lines, it is possible to form, at a position corresponding to the target portion when the covering portion is disposed at a position covering the upper surface, an opening portion penetrating a predetermined region including the target portion in the plate thickness direction and wall portions rising upward from an edge of the opening portion.
