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NERVE CUFF ELECTRODES FABRICATED USING OVER-MOLDED LCP
专利权人:
THE ALFRED MANN FOUNDATION FOR SCIENTIFIC RESEARCH
发明人:
Siegmar Schmidt,Boon Khai Ng
申请号:
US15634134
公开号:
US20180117313A1
申请日:
2017.06.27
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.
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