Faraji, Boozarjomehr,Zhou, David Daomin,Greenberg, Robert J.,Ok, Jerry,Talbot, Neil Hamilton,Little, James Singleton
申请号：
AU2011245293
公开号：
AU2011245293B2
申请日:
2011.04.29
申请国别(地区):
AU
年份:
2014
代理人:
摘要：
The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as by etching or by applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
