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Flexible printed circuit and a method of fabricating a flexible printed circuit
专利权人:
Siang Sin Foo;Choong Meng How
发明人:
Siang Sin Foo,Choong Meng How
申请号:
US14396964
公开号:
US10420215B2
申请日:
2012.06.29
申请国别(地区):
US
年份:
2019
代理人:
摘要:
Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
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中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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