A package structure (15) of a smart wearing function module and a smart wearing equipment comprising the package structure. The package structure (15) of the smart wearing function module comprises: a circuit board (2), a power supply module (5), and a package body casing (7) configured to accommodate electronic components the power supply module (5) is electrically connected to the circuit board (2) through wires and a sensor (3) configured to sense external parameters is arranged on the circuit board (2). The smart wearing equipment is provided with a wearing body (11) having an annular structure and the package structure of the smart wearing function module is clamped in an arc groove at an inner ring position of the wearing body (11). The package structure (15) of the smart wearing function module and the smart wearing equipment comprising the package structure well solve the problem of processing and assembling of electronic components and conventional jewelry accessories, do not influence respective functionalities, are more easily assembled and produced, reduce the process difficulty of processing a casing body, enable a wearer to realize functional interaction with products while dressing self, increase the practicality and the interestingness of the wearing equipment and enable the wearer to grasp health conditions thereof at any time.Linvention concerne une structure de boîtier (15) dun module à fonction à porter intelligent et un équipement à porter intelligent comprenant la structure de boîtier. La structure de boîtier (15) du module à fonction à porter intelligent comprend : une carte de circuit (2), un module dalimentation (5) et un logement de corps de boîtier (7) conçu pour loger des composants électroniques le module dalimentation (5) est électriquement connecté à la carte de circuit (2) par le biais de fils et un capteur (3) conçu pour détecter des paramètres externes est disposé sur la carte de circuit (2). Léquipement à porter intelligent compren
