A method fixes an implant on a balloon. The balloon, together with an implant, which is crimped onto a balloon surface of the balloon such that the implant by an inner side contacts a contact region of the balloon surface, is provided in the interior of a mold. The balloon interior is acted on by a pressure and the implant is inductively heated so that the contact region over the implant is heated and plastically deformed. The inner side of the implant is embedded in the balloon surface. Additionally, an assembly is produced by the method and an apparatus are provided for carrying out the method.
