Systems, methods, and apparatuses for dissipating heat from an ultrasound transducer are disclosed. A passive thermal management system including thermally conductive materials is disclosed. The passive thermal management system may include thermally conductive layers in a flexible circuit coupled to the transducer stack. The flexible circuit may be coupled to a thermally conductive bolster plate. The bolster plate may be coupled to a handle heat spreader that may be coupled to the interior surface of an ultrasound probe housing.
