The invention concerns a method for production of electronic assembly (1) with1.1 Supply of an electrically-conducting film (3), especially a support film (3a),1.2 Supply of at least one electrical component (5) with at least one electrical contact site (5c),1.3 Application of an adhesive (20) between the electrical component and a surface (30) of the electrically-conducting film,1.4 Arrangement of the at least one component (5) with the at least one electrical contact site (5c) on the surface (30) of the electrically-conducting film (3) and fastening of the at least one component by formation of an adhesive joint between the electrical component and the surface,1.5 Supply of the support (9), especially from a flexible material,1.6 Lamination of the film (3) with support (9) so that the at least one electrical component (5) is arranged between film (3) and support (9) and formation of a mechanical and electrical connection (23) between the electrical contact site of the at least one electrical component (5) and the electrically-conducting film (3) by low-temperature sintering of nanoparticles, especially from gold, silver, nickel or copper or from an alloy of these metals, in which lamination of the film occurs simultaneously with low-temperature sintering,1.7 Structuring of the electrically-conducting film (3) to conductor tracks (11) and/or cooling surfaces (13).
