A topical cooling compressive hemostasis wound healing device and methods thereof for affecting a percutaneous access site wound or an acute surgical wound. The device delivers and transports cooling to affect and control vasculature and musculoskeletal motions surrounding the injury site during the blood coagulation, hemostasis, and wound healing phases. The device comprises a viscoelastic and thermally conductive surface to deliver and transport an adjustable compressive pressure to resist outward blood flow, thus improving patient safety and clinical outcomes. The device is anatomically conforming and treats not only the specific injury site, but also its surrounding anatomical structures together as means to prevent unpredictable delayed hemostasis breach. The device provides comfort to the patient by allowing mobility upon wound healing, thus reducing back pain and strain resulting from being in constrained position for a prolonged period of time which is known to cause additional medical events. The device reduces pain, inflammation, swelling, and scar formation on the injury site of a patient and promotes hemostasis, sustains hemostasis, and improves overall wound healing quality.
