Described embodiments include an apparatus that includes a flexible electrically-insulating substrate, including an inner surface and an outer surface, and shaped to define (i) multiple narrower channels passing between the inner surface and the outer surface, and (ii) one or more wider channels passing between the inner surface and the outer surface. The apparatus further includes an outer layer of an electrically-conducting metal covering at least part of the outer surface, an inner layer of the electrically-conducting metal covering at least part of the inner surface, a plating layer of the electrically-conducting metal that plates the wider channels such as to connect the outer layer to the inner layer, and respective columns of the electrically-conducting metal that fill the narrower channels such as to connect the outer layer to the inner layer. Other embodiments are also described.
