A semiconductor refrigeration electronic icepack comprising an icepack main body (1). A thermally-conductive liquid is provided within the icepack main body (1). Also comprised is an external mobile refrigeration source box (4). The interior of the mobile refrigeration source box (4) is partitioned into a heat-dissipation area and an enclosed refrigeration area by a semiconductor refrigeration plate (7) and a connecting plate connected at two ends of the semiconductor refrigeration plate (7). A heat exchange water-cooling head (5) is arranged on the semiconductor refrigeration plate (7) at the refrigeration area. The thermally-conductive liquid in the icepack main body (1) is connected to the heat exchange water-cooling head (5) via a liquid inlet tube (3) and is connected to a water pump (9) and the heat exchange water-cooling head (5) via a liquid outlet tube (31). A heat sink (8) is arranged on the semiconductor refrigeration plate (7) at the heat-dissipation area. A ventilation hole (10) is provided on a sidewall of the mobile refrigeration source box (4) corresponding to the heat-dissipation area. The semiconductor refrigeration plate (7) and the water pump (9) are provided with a power supply connection cable. The mobile refrigeration source box (4) is convenient to carry. The semiconductor refrigeration plate (7) and the water pump (9) are powered up to allow the refrigeration source box to start working, thereby allowing the thermally-conductive liquid in the icepack main body (1) to exchange heat with the refrigeration plate (7) in the refrigeration source box, thus reducing the temperature of the electronic icepack.La présente invention concerne un bloc réfrigérant électronique à réfrigération à semi-conducteur comprenant un corps principal de bloc réfrigérant (1). Un liquide thermiquement conducteur est disposé dans le corps principal de bloc réfrigérant (1). Il est également inclus un boîtier de source de réfrigération mobile externe (4). Lintérieur du b
