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Hermetic conductive feedthroughs for a semiconductor wafer
专利权人:
MEDTRONIC; INC.
发明人:
David A. Ruben,Michael S. Sandlin
申请号:
US14050415
公开号:
US10464836B2
申请日:
2013.10.10
申请国别(地区):
US
年份:
2019
代理人:
摘要:
A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.
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中国工程科技知识中心
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http://www.ckcest.cn/home/
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