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In-situ fold-assisting frame for flexible substrates
专利权人:
发明人:
申请号:
EP11193759.5
公开号:
EP2465575B1
申请日:
2011.12.15
申请国别(地区):
EP
年份:
2015
代理人:
摘要:
A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. In an exemplary embodiment, the frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature such as a hinge incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including implantable medical devices.
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中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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