A filament may be provided having enhanced solderability and/or heating characteristics configured for heating a substance to release an airborne scent. In exemplary implementations, the ends of a high-temperature compatible filament may be coated with a metal film having greater solderability and/or conductivity relative to the filament. The coated ends may allow the filament to be incorporated into a heating circuit using low-temperature solder, rather than by using high-temperature solder or clamping. The coated ends may have a lower resistance relative to uncoated portions of the filament such that, when electrical current is passed through the filament, most of the current will flow through the coating at the end portions of the filament concentrating heat emitted by the filament to the uncoated portions.
