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PERCUTANEOUS LEAD PLACEMENT ASSEMBLY
专利权人:
Avent; Inc.
发明人:
Ryan Caldwell,Eric A. Schepis,Phillip A. Schorr,Shyamy R. Sastry
申请号:
US16355670
公开号:
US20190282267A1
申请日:
2019.03.15
申请国别(地区):
US
年份:
2019
代理人:
摘要:
The exemplified systems and methods facilitate a nerve conduction block at a target nerve using electrical stimulation applied from one or more electrodes located on a percutaneous lead that are placed in parallel, or substantially in parallel, and without direct contact, to a long axis of the peripheral nerve over an overlapping nerve region of greater than about 3 millimeters. The exemplified system and method can be further configured to block nerve condition without eliciting onset activity and co-excitation of non-targeted structures. The exemplified method and system can be performed using conventional percutaneous leads, though an improved percutaneous lead design is disclosed herein. In an aspect, an introducer is disclosed that facilitates accurate and consistent insertion of the percutaneous lead to the specified or intended position relative to the target nerve. In another aspect, a treatment kit comprising the various system components to treat pain is disclosed.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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