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APPARATUSES AND METHODS FOR COOLING A SURFACE
专利权人:
EMPIRE TECHNOLOGY DEVELOPMENT LLC
发明人:
Benjamin William MILLAR,George Charles PEPPOU,Michael Keoni MANION,Maggie Chai Cin NG
申请号:
US14449571
公开号:
US20160030233A1
申请日:
2014.08.01
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Methods and apparatuses for providing localized cooling of a surface are described. Localized cooling devices may include a thermal element configured to generate a temperature gradient in a cooling interface in contact with the surface. Temperature gradient may operate to facilitate conductive heat transfer from the surface, through the cooling interface, and out into the ambient environment. The thermal elements may include thermoelectric cooling elements (TECs), such as Peltier cooling elements. In some embodiments, the localized cooling devices may be configured to treat swelling associated with periorbital edema by providing convenient, efficient, and continuous cooling of the affected area.
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