A fluid application apparatus is disclosed having adhesive compositions and controlled release compositions for applying treatments such as pesticides, herbicides, and fertilizers, to target plants, and the like. In at least one embodiment, the application apparatus includes a treatment release device adapted to release a pesticide, herbicide, fertilizer, or the like, for adhesion to and treatment of a target plant, the release device comprising: a substrate a quantity of media adapted to contain a controlled release composition disposed upon the substrate and adapted to release the controlled release composition to a target plant for treatment and an adhesive composition disposed upon the substrate and adapted to adhere the treatment release device and the quantity of media adapted to contain a controlled release composition to the target plant for treatment.
