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Electrically conductive patterns with wide line-width and methods for producing same
专利权人:
3M INNOVATIVE PROPERTIES COMPANY
发明人:
Chi-fan Chen,Wan-chun Chen,Yu-chih Lin,Tze Yuan Wang,Chia-yuan Liu
申请号:
US15515399
公开号:
US10399851B2
申请日:
2015.09.28
申请国别(地区):
US
年份:
2019
代理人:
摘要:
A master tool is provided with an ink pattern on a major surface thereof. The ink pattern is formed by a screen printing process. A stamp-making material is applied to the major surface of the master tool to form a stamp having a stamping pattern being negative to the ink pattern of the master tool. The stamping pattern is inked with an ink composition and contacted with a metalized surface to form a printed pattern on a metalized surface of a substrate according to the stamping pattern. Using the printed pattern as an etching mask, the metalized surface is etched to form electrically conductive traces on the substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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