Isaac Ostrovsky,Jianmin Li,Tim Harrah,Jozef Slanda
申请号：
US13177241
公开号：
US09113990B2
申请日:
2011.07.06
申请国别(地区):
US
年份:
2015
代理人:
摘要：
An implant includes a substrate and a carrier coupled to the substrate. The carrier including a plurality of objects configured to reflect energy emitted by an ultrasound device. In some embodiments, the carrier includes a plurality of air bubbles that are configured to reflect energy emitted by an ultrasound device. In one embodiment, a method of forming a bodily implant includes forming a substrate, disposing a plurality of air bubbles within a carrier, and applying the carrier to the substrate.
