An insert molded product in which a metal base member and a resin are bonded together includes a ground layer； a noble metal layer formed of a noble metal； a compound layer formed of a compound containing silicon (Si) and oxygen (O)； and a mixture layer where the compound and the resin are mixed together, wherein the ground layer, the noble metal layer, the compound layer, and the mixture layer are formed in this order on the metal base member, and wherein nickel (Ni) is included in both the compound layer and the mixture layer.
