A peel away lead implant tool is adapted to be disposed over the terminal connector of a lead during an implantation procedure to protect the terminal connector. The peel-away lead implant tool includes a flexible polymer sheath including electrical contacts formed in a contact region of the sheath. The electrical contacts can be either metal foil contacts or conductive polymer contacts and extend from an outer surface to an inner surface of the sheath such that when the testing apparatus is coupled to the lead implant tool, the electrical contacts are pressed into electrical contact with the ring electrodes located on the terminal connector. The lead implant tool configured for facilitating the easy removal of the implant tool from the terminal connector when the implantation procedure is complete.
