An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.
