Thermal management solutions for wireless power transfer systems are provided, which may include any number of features. In one embodiment, an implantable wireless power receiver includes at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver. The thermal layer can comprise, for example, a copper layer or a ceramic layer embedded in an acrylic polymer matrix. In some embodiments, a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection. In yet another embodiment, a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver. Methods of use are also provided.
