Ultrasonic device and manufacturing method thereof, electronic apparatus and ultrasonic imaging apparatus

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专利权人:

セイコーエプソン株式会社

发明人:

清瀬 摂内

申请号：

JP2013240277

公开号：

JP6252130B2

申请日:

2013.11.20

申请国别(地区):

JP

年份:

2017

代理人:

摘要：

An ultrasonic device (17) includes a substrate (44), an acoustic adjustment layer (51), an acoustic lens (52) and a structural member (53). The substrate has an element array (22) including a plurality of thin film ultrasonic transducer elements (28) arranged in an array form. The acoustic adjustment layer covers the element array. The acoustic lens is arranged above the acoustic adjustment layer. The structural member is in contact with the acoustic lens and fixed to the substrate. The structural member has a modulus of rigidity greater than a modulus of rigidity of the acoustic lens.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/