A photocatalytic material 100 which comprises a base 10 and a photocatalytic layer 20 disposed on one surface of the base. The photocatalytic layer comprises photocatalyst particles 21, copper compound particles 22 comprising copper(II) oxide and/or copper(II) hydroxide, inorganic particles 23 having no photocatalytic activity, and an inorganic binder 24, the amount of the copper contained in the copper compound particles being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles. The copper compound particles have been fixed so as to be in contact with the surfaces of the photocatalyst particles and inorganic particles. The present invention further provides a photocatalytic coating composition which is for forming the photocatalytic layer of said photocatalytic material. The photocatalytic coating composition comprises photocatalyst particles, a copper compound which is a precursor of copper(II) oxide and copper(II) hydroxide and which comprises a compound of a divalent copper ion, inorganic particles having no photocatalytic activity, and a precursor of an inorganic binder, the amount of the copper contained in the copper compound being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles.光觸媒材料100具有基材10、及設置於基材之一面之光觸媒層20。並且,光觸媒層包含光觸媒粒子21、含有氧化銅(II)及氫氧化銅(II)之至少一者的銅化合物粒子22、不具有光觸媒活性之無機粒子23、及無機黏合劑24,相對於光觸媒粒子100質量份,銅化合物粒子中之銅為0.1~5質量份。並且,銅化合物粒子係以與光觸媒粒子及無機粒子之表面接觸之方式被擔載。光觸媒塗料組合物係用以形成光觸媒材料中之光觸媒層之塗料組合物,且包含:光觸媒粒子;銅化合物,其係氧化銅(II)及氫氧化銅(II)之前驅物,且至少包含2價銅離子化合物;無機粒子,其不具有光觸媒活性;及無機黏合劑前驅物;相對於光觸媒粒子100質量份,銅化合物中之銅為0.1~5質量份。10‧‧‧基材20‧‧‧光觸媒層21‧‧‧光觸媒粒子22‧‧‧銅化合物粒子23‧‧‧不具有光觸媒活性之無機粒子24‧‧‧黏合劑100‧‧‧光觸媒材料
