生体組織切断・接着用装置
- 专利权人:
- 学校法人神奈川大学
- 发明人:
- 山口 栄雄
- 申请号：
- JP2009056483
- 公开号：
- JP5316944B2
- 申请日:
- 2009.03.10
- 申请国别(地区):
- JP
- 年份:
- 2013
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To provide living tissue cutting/adhesion apparatus which, when heating and cooling a cutting/adhesion region by using Peltier effect, lowers the lowest temperature in the cooling and reduces time required for lowering the temperature to a desired temperature.
SOLUTION: The living tissue cutting/adhesion apparatus comprises: semiconductor parts 2, 3 disposed facing each other an electrode/heat exchange parts 5, 6 disposed in the respective semiconductor parts a joint part 4 which is interposed between the semiconductor parts, joints the semiconductor parts, and has heat conductivity and electrodes 8, 9 respectively disposed in the electrode/heat exchange parts 5, 6. In the joint part 4, the cutting/adhesion region 15 protruding outward from the semiconductor parts 2, 3 are formed. The living tissue cutting/adhesion apparatus further includes: an electrical circuit 10 including a power source 18 for supplying the semiconductor parts 2, 3 with direct current from the electrodes 8, 9 and a converter 20 for switching direction of the current a heat exchange medium circulation path 11 where water or the like circulates a pump 28 and a liquid tank 27 placed on the heat exchange medium circulation path 20. The heat exchange medium circulation path 20 adopts a passage passing inside the electrode/heat exchange parts 5, 6.
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- 来源网站：
- 中国工程科技知识中心
